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Desoldadura y soldadura de iPhone X PMU

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Desoldering & Soldering of iPhone X PMU: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Desoldering & Soldering of iPhone X PMU: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Tips: since components around are close to PMU we need to be careful when removing black adhesive to avoid knocking components off the board.

  • Continue to heat up PMU with Hot Air Gun at 330℃, air flow 5. Also when heating, get one lever of the tweezers fixed first. 15s later, as solder starts to melt, pry up the chip quickly with the other lever. Tips: make sure you pry up the chip at the right time. Otherwise, the bonding pad might get damaged.

Sugerencias: dado que los componentes alrededor están cerca de la PMU, debemos tener cuidado al quitar el adhesivo negro para evitar que los componentes se caigan de la placa.

Continúa calentando la PMU con la pistola de aire caliente a 330 ℃, flujo de aire 5. Al calentar, fija primero una palanca de las pinzas. 15 segundos después, cuando la soldadura comience a derretirse, levanta el chip rápidamente con la otra palanca. Asegúrate de levantar el chip en el momento adecuado o la almohadilla de unión podría dañarse.

[* black] Tips: since components around are close to PMU we need to be careful when removing black adhesive to avoid knocking components off the board.
-[* black] Continue to heat up PMU with Hot Air Gun at 330℃, air flow 5. Also when heating, get one lever of the tweezers fixed first. 15s later, as solder starts to melt, pry up the chip quickly with the other lever. Tips: make sure you pry up the chip at the right time. Otherwise, the bonding pad might get damaged.
+[* black] Continue to heat up PMU with Hot Air Gun at 330℃, air flow 5. Also when heating, get one lever of the [product|IF145-020|tweezers] fixed first. 15s later, as solder starts to melt, pry up the chip quickly with the other lever. Tips: make sure you pry up the chip at the right time. Otherwise, the bonding pad might get damaged.

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