crwdns2933423:0crwdne2933423:0
crwdns2918538:0crwdne2918538:0

crwdns2918574:0crwdne2918574:0

crwdns2933947:0crwdne2933947:0

crwdns2930901:0crwdne2930901:0

crwdns2933951:0crwdne2933951:0

crwdns2918742:0crwdne2918742:0

crwdns2933953:020crwdne2933953:0

CRWDNS2930815:0CRWDNE2930815:0

crwdns2930797:0crwdne2930797:0: crwdns2931709:0Motherboard differences: iPhone XR China...
crwdns2933937:0crwdne2933937:0:
crwdns2933939:0crwdne2933939:0: oldturkey03 (crwdns2933941:0crwdne2933941:0)

crwdns2916018:0crwdne2916018:0

crwdns2933933:028crwdne2933933:0

crwdns2930803:0crwdne2930803:0

Motherboard differences: iPhone XR China dual-SIM vs EU/US eSIM+SIM

it would be great to see the motherboard differences between the true dual-SIM version available in mainland China, Hong Kong and Macau and the international eSIM+nano-SIM version.


crwdns2933933:075.1crwdns2936485:0crwdne2936485:0crwdne2933933:0

crwdns2930801:0crwdne2930801:0

Comparing with iPhone XS Max, I believe the idea is the same. China model has exactly the same board layout, they only change the SIM socket and tray part. China model has actual dual sided SIM socket eSIM chip vacant or disabled via software, while global model has the same size SIM socket, but with one side blocked, eSIM chip is installed and enabled.