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iPhone 6 の分解

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iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • The front side of the logic board:

  • Apple A8 APL1011 SoC + SK Hynix RAM as denoted by the markings H9CKNNN8KTMRWR-NTH (we presume it is 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus)

  • Qualcomm MDM9625M LTE Modem

  • Skyworks 77802-23 Low Band LTE PAD

  • Avago A8020 High Band PAD

  • Avago A8010 Ultra High Band PA + FBARs

  • Skyworks 77803-20 Mid Band LTE PAD

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo

基板の正面側を見てみましょう。

Apple A8 APL1011 SoC + H9CKNNN8KTMRWR-NTHと表示されているSK Hynix RAM (iPhone 6 Plusに搭載されているものと同一か)

Qualcomm MDM9625M LTE モデム

Skyworks 77802-23 Low Band LTE PAD

Avago A8020 High Band PAD

Avago A8010 Ultra High Band PA + FBARs

Skyworks 77803-20 Mid Band LTE PAD

InvenSense MP67B 6軸 ジャイロスコープと加速度メーターのコンボ

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