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iPhone 6 Plus 분해도

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iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • More ICs on the front of the logic board:

  • Qualcomm QFE1100 Envelope Tracking IC

  • RF Micro Devices RF5159 Antenna Switch Module

  • Skyworks SKY77356-8 Mid Band PAD

  • Bosch Sensortec BMA280 3-Axis Accelerometer

로직 보드 전면의 더 많은 IC:

Qualcomm QFE1100 엔벨롭 트랙킹 IC

RF Micro Devices RF5159 안테나 스위치 모듈

Skyworks SKY77356-8 Mid Band PAD

Bosch Sensortec BMA280 3-축 가속도계

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