crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

iPhone 6 Plus 분해도

crwdns2935419:0crwdne2935419:0
crwdns2936315:0crwdne2936315:0
crwdns2936325:0crwdne2936325:0
crwdns2931653:019crwdne2931653:0
iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Let's identify some ICs on the front side of the logic board:

  • Apple A8 APL1011 SoC + Elpida 1 GB LPDDR3 RAM (as denoted by the markings EDF8164A3PM-GD-F)

  • Qualcomm MDM9625M LTE Modem

  • Skyworks 77802-23 Low Band LTE PAD

  • Avago ACPM-8020 High Band PAD

  • Avago ACPM-8010 Ultra High Band PA + FBARs

  • TriQuint TQF6410 3G EDGE Power Amplifier Module

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo

로직 보드 전면에 위치한 IC들을 식별해 봅시다:

Apple A8 APL1011 SoC + Elpida 1GB LPDDR3 RAM (EDF8164A3PM-GD-F 표식)

Qualcomm MDM9625M LTE 모뎀

Skyworks 77802-23 Low Band LTE PAD

Avago ACPM-8020 High Band PAD

Avago ACPM-8010 Ultra High Band PA + FBARs

TriQuint TQF6410 3G EDGE 전원 증폭 모듈

InvenSense MP67B 6-축 자이로스코프 및 가속도계 콤보

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