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iPhone 6 Plus 분해도

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iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • Back of the logic board.

  • SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash

  • Murata 339S0228 Wi-Fi Module

  • Apple/Dialog 338S1251-AZ Power Management IC

  • Broadcom BCM5976 Touchscreen Controller

  • NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)

  • NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)

  • Qualcomm WTR1625L RF Transceiver

로직 보드 후면.

SK Hynix H2JTDG8UD1BMS 128Gb (16GB) NAND 플래시

Murata 339S0228 Wi-Fi 모듈

Apple/Dialog 338S1251-AZ 전원 관리 IC

Broadcom BCM5976 Touchscreen 컨트롤러

NXP LPC18B1UK ARM Cortex-M3 Microcontroller (별칭 M8 모션 코프로세서)

NXP 65V10 NFC 모듈 + Secure Element (NXP PN544 NFC 컨트롤러 매장)

Qualcomm WTR1625L RF 송수신기

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