crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

iPhone 6 Plus 拆解

crwdns2935419:0crwdne2935419:0
crwdns2936315:0crwdne2936315:0
crwdns2936311:0crwdne2936311:0
crwdns2931653:021crwdne2931653:0
iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • Back of the logic board.

  • SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash

  • Murata 339S0228 Wi-Fi Module

  • Apple/Dialog 338S1251-AZ Power Management IC

  • Broadcom BCM5976 Touchscreen Controller

  • NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)

  • NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)

  • Qualcomm WTR1625L RF Transceiver

逻辑板後方。

SK Hynix H2JTDG8UD1BMS 128 Gb (16 GB) NAND Flash

Murata 339S0228 WiFi Module

Apple/Dialog 338S1251-AZ Power Management IC

Broadcom BCM5976 touchscreen controller

NXP LPC18B1UK ARM Cortex-M3 Microcontrollers (also known as the M8 Motion Coprocessor)

NXP 65V10 NFC module + Secure Element (Most likely contains an NXP PN544 NFC controller inside)

Qualcomm WTR1625L RF Transceiver

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0