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iPhone 6 Plus 拆解

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iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • More ICs on the back of the logic board:

  • Qualcomm WFR1620 receive-only companion chip. Qualcomm states that the WFR1620 is "required for implementation of carrier aggregation with WTR1625L."

  • Qualcomm PM8019 Power Management IC

  • Texas Instruments 343S0694 Touch Transmitter

  • AMS AS3923 NFC Booster IC

  • Cirrus Logic 338S1201 Audio Codec

  • Bosch Sensortec BMP280

  • A big and hearty mega-thanks to our pals at Chipworks for helping us ID all of this tech. We definitely couldn't have done it without them!

更多集成电路在逻辑板後方。

Qualcomm WFR1620 receive-only companion chip。 Qualcomm 声明 WFR1620 是 "有需要用它來执行载波聚合WTR1625L."

Qualcomm PM8019 power management IC

Texas Instruments 343S0694 touch transmitter

AMS AS3923 boosted NFC tag front end

我们相信这只是一个AMSAS3922简单的小改版，这使得“支付功能在超小范围像SIM卡和μSD“。

Cirrus Logic 338S1201 audio codec

我們誠心感謝Chipworks的朋友們幫忙我們ID所有的技术。沒有你們的協助我們做不了的！

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