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iPhone 6 Plus 拆解

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iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0

  • More ICs on the front of the logic board:

  • Qualcomm QFE1100 Envelope Tracking IC

  • RF Micro Devices RF5159 Antenna Switch Module

  • Skyworks SKY77356-8 Mid Band PAD

  • Bosch Sensortec BMA280 3-Axis Accelerometer

更多集成电路在逻辑板前方。

Qualcomm QFE1000 Envelope Tracking IC

RFMD RF5159 Antenna Switch Module

SkyWorks 77356-8 Mid-Band PAD

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