crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

iPhone 6 Plus 분해도

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crwdns2936315:0crwdne2936315:0
crwdns2936325:0crwdne2936325:0
crwdns2931653:022crwdne2931653:0
iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • More ICs on the back of the logic board:

  • Qualcomm WFR1620 receive-only companion chip. Qualcomm states that the WFR1620 is "required for implementation of carrier aggregation with WTR1625L."

  • Qualcomm PM8019 Power Management IC

  • Texas Instruments 343S0694 Touch Transmitter

  • AMS AS3923 NFC Booster IC

  • Cirrus Logic 338S1201 Audio Codec

  • Bosch Sensortec BMP280

  • A big and hearty mega-thanks to our pals at Chipworks for helping us ID all of this tech. We definitely couldn't have done it without them!

로직 보드 뒷면의 더 많은 IC:

Qualcomm WFR1620 수신-전용 컴패니언 칩. Qualcomm은 WFR1620이 "WTR1625L 사용 반송파 결합 실행에 필요하다"고 말합니다.

Qualcomm PM8019 전원 관리 IC

Texas Instruments 343S0694 Touch 수신기

AMS AS3923 NFC Booster IC

Cirrus Logic 338S1201 오디오 코덱

Bosch Sensortec BMP280

이 모든 기술을 식별할 수 있도록 도와준 Chipworks 친구들에게 큰 감사의 마음을 전합니다. 그들 없이 우리는 절대로 해낼 수 없었습니다!

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