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Separación de la placa base del iPhone 13 Pro

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iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Then we remove thermal grease on the chips.

  • The size of the A15 chip has increased a lot, which makes CPU desoldering more difficult.

Luego retiramos la grasa térmica de los chips.

El tamaño del chip A15 ha aumentado mucho, lo que dificulta el desoldado de la CPU.

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