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任天堂Wii U拆解

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Nintendo Wii U Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Nintendo Wii U Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Nintendo Wii U Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Next to come out are the fan and heat sink.

  • Nintendo designers explained that the larger fan and heat sink were necessary to handle the nearly tripled heat output from the new ICs.

  • With the heat sink off, we get closer to the CPU and GPU, called the Wii U's multi chip module (MCM), still hidden beneath a thermal pad.

  • Thanks to the upgraded AMD GPU, the Wii U boasts HD graphics up to 1080p.

  • Nintendo has come a long way over the years, considering that we remember when Mario had fewer bits than our old 26-bit driver kit.

接下来是风扇和散热片的部分。

据任天堂工程师的说明,按新芯片相比Wii近乎三倍的发热量,必须使用更大的风扇和散热器才能有效散热。

掀起散热金属板后,在铝散热器下方还隔着一块固态硅脂,之后才是Wii U的核心部件——整合了CPU和GPU的多芯片模组(MCM)。

由于采用升级后的AMD GPU,Wii U具备1080P高清输出能力。

这是多年来任天堂的主机道路上,终于迈出的纪念性的一步。

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