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HTC Vive Pro 拆解

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HTC Vive Pro Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 HTC Vive Pro Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 HTC Vive Pro Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Scan complete—chips identified:

  • Two Nordic Semiconductor NRF24LU1P Ultra Low Power 2.4 GHz RF SoC

  • Atmel SAM G55J 32-bit microcontroller

  • Two Winbond 25Q32JV1Q 4 MB flash memory

  • Alpha Imaging Technology AIT8589D—likely an updated version of the Image Signal Processor we saw in the first Vive

  • Lattice Semiconductor iCE40HX8K Ultra Low Power FPGA

  • TDK (formerly Invensense) MPU-6500 3-axis accelerometer/gyroscope

  • In the third image: A Triad Semiconductor TS4231 Light-to-Digital Converter IC nestles close to each IR sensor, ready to convert IR light pulses into digital signals.

扫描完成——芯片信息

两款北欧半导体NRF24LU1P超低功耗2.4 GHz RF SoC

Atmel SAM G55J 32位微控制器

两个Winbond 25Q32JV1Q 4 MB闪存

Alpha Imaging Technology AIT8589D-可能是我们在初代Vive中看到的图像信号处理器的更新版本

莱迪思半导体iCE40HX8K超低功耗FPGA

在第三幅图像中:Triad Semiconductor TS4231光电数字转换器IC靠近每个红外传感器,随时可将红外光脉冲转换为数字信号。

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