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Smontaggio HomePod

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HomePod Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 HomePod Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 HomePod Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.

  • Chipwise, we spy:

  • Apple A8 APL1011 SoC (we’ve seen this before, but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)

  • Toshiba THGBX4G7D2LLDYC 16 GB NAND flash

  • USI 339S00450 WiFi/Bluetooth module, likely with a Broadcom BCM43572 trapped inside

  • Apple/Dialog Semiconductor 338S00100-AZ PMIC

  • Interestingly, the reverse has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

Il prossimo disco estratto supporta gli elaborati punti di attracco per il cordoncino; dietro c'è la scheda logica principale.

Quanto ai chip, troviamo:

SoC Apple A8 APL1011 SoC (l'abbiamo già visto in precedenza, ma faceva un lavoro diverso), probabilmente accoppiato a 1 GB di RAM integrata sotto

16 GB di memoria flash NAND Toshiba THGBX4G7D2LLDYC

Modulo Wi-Fi/Bletooth USI 339S00450, probabilmente con un Broadcom BCM43572 intrappolato dentro

Apple/Dialog 338S00100-AZ PMIC

Interessante il fatto che il retro abbia alcune aree disabitate per componenti SMD, pochi chip e molte parti passive. Forse ci sono stati dei cambiamenti progettuali dell'ultima ora nello HomePod?

[* black] The next disc to come out holds those elaborate drawstring moorings—and behind it, the main logic board.
[* black] Chipwise, we spy:
- [* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM layered underneath
+ [* red] Apple A8 APL1011 SoC ([guide|29213|we’ve seen this before|stepid=69254|new_window=true], but doing a different job), likely paired with 1 GB RAM (layered on top in typical PoP configuration)
[* orange] Toshiba THGBX4G7D2LLDYC 16 GB NAND flash
[* yellow] USI 339S00450 WiFi/Bluetooth module, likely with a [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|Broadcom BCM43572 trapped inside|new_window=true]
- [* green] Apple/Dialog [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
+ [* green] Apple/Dialog Semiconductor [http://techinsights.com/about-techinsights/overview/blog/apple-homepod-teardown/|338S00100-AZ|new_window=true] PMIC
[* black] Interestingly, [https://d3nevzfk7ii3be.cloudfront.net/igi/UYNZVyo2AiAL1djs|the reverse|new_window=true] has some unpopulated SMD pads, for a few chips and several passives. Maybe the HomePod underwent some last-minute design changes?

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