Since the heating platform for iPhone 13 Pro has not come out yet, we use a universal heating platform at 170 °C for separation. Because the middle layer of iPhone 13 lineup’s motherboard still uses middle-temperature Solder Paste for soldering.

Add heat with Hot Air Gun at 330 °C around the motherboard, when the temperature of the Heating Platform reaches 150 °C. As the logic board becomes loose, remove the logic board with tweezers.

Be careful not to damage surrounding components while removing.

The CPU is stacked with the baseband which is bad for motherboard heat dissipation.