iPhone 13 Pro Motherboard Separation

crwdns2936025:04crwdne2936025:0 —

crwdns2935483:0crwdne2935483:0

For better heat dissipation, both sides of the motherboard are covered with thick heat dissipation tape.

Then we remove foam on the motherboard. Remove tape on the motherboard with Hot Air Gun at 100 °C. It can be seen that NAND is under the A15 tape.

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0

crwdns2935431:0crwdne2935431:0