Put the signal board on the 160 °C Heating Platform to heat. After the solder balls are formed, cool the signal board. Apply some Paste Flux on the bonding pad. Align the logic board with the signal board.

Keep heating to recombine the motherboard. Remove the motherboard after heating for about 2 minutes. Connect the motherboard with a power cable after it has cooled. Trigger the boot-up with tweezers. The boot current jump is normal.

Then we install the motherboard. The phone can be turned on. IMEI number can also be seen. The fault has been cleared.