Apply some Paste Flux to the bonding pad. Align the new USB IC. Heat to solder the USB IC with Hot Air Gun at 340 °C. Remove tin on the bonding pad with Soldering Iron at 365 °C and solder wick. Clean tin on the bonding pad of the signal board with the same method. Clean the bonding pad with PCB Cleaner.

Then we install the motherboard to the Testing Fixture. Connect the power cable and screen. Trigger the boot-up with tweezers. The phone can be turned on.