The next thing we need to do is to recombine the logic board and signal board. Put the signal board on the Reballing Platform. Put the Reballing Stencil in position. To prevent the solder paste from flowing into the motherboard crevices, insert a metal plate.

Apply a layer of low-temperature Solder Paste. Wipe off excess solder paste with an anti-static wipe. Remove the Reballing Stencil and signal board.