Set the temperature of the Heating Platform to 180℃ to heat the motherboard. When the temperature reaches 180℃, press the signal board with a pair of tweezers. Clamp the screw to remove the logic board with another pair of tweezers. Then turn off the power and take down the signal board.

Remove thermal grease on the logic board and signal board. Attach the signal board to the holder. Dip rosin with Soldering Iron at 365℃ and solder wick to remove tin on the bonding pad. Remove tin on the logic board with the same method.