Once completed, place the lower layer on the heating platform. Apply some BGA paste flux to the bonding pad and get the upper layer in the right position.

Heat for 2 minutes on the heating platform at 165℃.

Now we can assemble the phone and test. Get the motherboard installed and display assembly connected. Press the power button to turn on the phone. The phone turns on normally.

Place the phone on a wireless charger and the phone can be wirelessly charged.