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iPhone X Wireless Charging IC Replacement

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The first thing we do is to separate the upper layer from the lower layer. Place the motherboard on the heating platform and fit a screw into the screw hole on the motherboard. So we can take down the upper layer efficiently afterward.

Heat the motherboard for 2 minutes on the heating platform at 165℃.

After heating, take down the upper layer with tweezers and then the lower layer.

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