Clean with PCB Cleaner afterwards.

There is black adhesive around the bonding pad of U_PMIC_E. So we need to remove the black adhesive with tweezers before soldering.

Once done, apply Paste Flux to the bonding pad. Get a new U_PMIC_E in position and solder with Hot Air Gun at 330℃, air flow 3.

After that, clean with PCB Cleaner and tear off the High-temperature Tape.