The phone goes with activation process. Click the icon at the bottom right corner. Serial number displays normally on the screen. No IMEI number on the screen. The phone shows a No Service error in the upper-right corner.

We can confirm now that the bonding pad has not been pseudo soldered. The fault is related to the lower layer. So we need to further check the lower layer.

Run diode mode measurement of signal relevant pins on the bonding pad. Nothing goes wrong.

Continue to run diode mode measurement of capacitors related to the power supply circuit of U_PMIC_E. Nothing goes wrong.

Judging by this, the fault is probably related to U_PMIC_E or U_MDM_E.