And here it is. The Apple S1 computer-on-chip. Where we were earlier thwarted, we've got a better look with some interesting analysis.

By encasing the S1 in resin, Apple was able to make use of wire bonding to make many of the connections between chips in Package on Package (PoP) stacks. These are incredibly small bonds, typically 10-17 microns.

This saves space, as soldered packages would be thicker, but requires a whole new level of manufacturing expertise.

Here's the one exposed chip on the S1, an STMicroelectronics gyroscope and accelerometer.