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Xbox 360 E Teardown

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It's time to think inside the box. The prominent ICs found on the frontside of the motherboard:

GlobalFoundries (joint venture of AMD and ATIC) XCGPU SoC (combination of the Xenon CPU and the Xenos X818337 GPU onto the same die, with eDRAM in the same package)

Microsoft X850744-004 south bridge

Hynix HY27US08281A 128 Mb NAND flash

Samsung K4J10324KG-HC14 1 Gb GDDR3 SDRAM (total of four = 4 Gb)

On the backside...

A green land flecked with gold and the hopes of the internet-free gamers of tomorrow.

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