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Xiaomi Mi 11 Teardown

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And on the even darker rear side, a huge expanse of copper conceals these tiny bits of silicon:

Qualcomm SM8350 Snapdragon 888 (5 nm) with integrated X60 modem, layered underneath Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 3200MHz

SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1

Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC

Qualcomm SDR868-RF transceiver chip

Qualcomm SMB1396 fast charging chip

Nuvolta NU1619A wireless power receiving chip

Qorvo QM77033D front-end module

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