crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0
crwdns2918538:0crwdne2918538:0

Samsung Galaxy Z Flip Teardown

crwdns2936025:08crwdne2936025:0 —
crwdns2916944:0crwdne2916944:0

crwdns2935477:0crwdne2935477:0:

crwdns2935483:0crwdne2935483:0

More chips inside this silicon sandwich include:

Qualcomm PM8150 power management IC

Qualcomm WCD9341 audio codec

Samsung S2MIW04 power management

Samsung S2DOS04 DC-DC converter (likely for the backlight)

Qualcomm QDM3870 RF front-end module

Samsung S2MPB02 power management IC

Likely a Texas Instruments TAS2562 audio amplifier

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0