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HTC Vive Pro Teardown

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crwdns2935477:0crwdne2935477:0:

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Scan complete—chips identified:

Two Nordic Semiconductor NRF24LU1P Ultra Low Power 2.4 GHz RF SoC

Atmel SAM G55J 32-bit microcontroller

Two Winbond 25Q32JV1Q 4 MB flash memory

Alpha Imaging Technology AIT8589D—likely an updated version of the Image Signal Processor we saw in the first Vive

Lattice Semiconductor iCE40HX8K Ultra Low Power FPGA

TDK (formerly Invensense) MPU-6500 3-axis accelerometer/gyroscope

In the third image: A Triad Semiconductor TS4231 Light-to-Digital Converter IC nestles close to each IR sensor, ready to convert IR light pulses into digital signals.

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