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iPhone 8 拆解

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iPhone 8 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 8 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • And on the back side:

  • Apple/USI 170804 339S00397 WiFi/Bluetooth module

  • Apple/Dialog Semiconductor 338S00309 PMIC and Cirrus Logic 338S00248 audio codec and 338S00286 audio amplifier

  • Toshiba TSBL227VC3759 64 GB NAND flash storage

  • Qualcomm WTR5975 Gigabit LTE RF transceiver and PMD9655 PMIC

  • Broadcom BCM59355—Likely an iteration of BCM59350 wireless charging IC

  • NXP CBTL1612A1—Likely an iteration of the 1610 tristar IC

  • Skyworks 3760 3576 1732 RF switch and SKY762-21 247296 1734 RF switch

让我们来到主板的背面：

苹果（Apple）/环旭电子（USI） 170804 339S00397 WiFi/蓝牙模块

苹果（Apple）/戴乐格半导体（Dialog Semiconductor） 338S00248电源管理IC，凌云逻辑（Cirrus Logic）338S00309音频编解码器以及S3830028音频放大器

东芝（Toshiba）TSBL227VC3759 64GB NAND闪存芯片

高通（Qualcomm）WTR5975 千兆LTE收发模组以及PMD9655 PMIC

博通（Broadcom）BCM59355—可能是迭代的BCM59350无线充电控制IC

恩智浦（NXP) CBTL1612A1—可能是迭代的 1610 Tristar IC

思佳讯（Skyworks）3760 3576 1732射频开关以及SKY762-21 247296 1734射频开关

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