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iPhone 8 拆解

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iPhone 8 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone 8 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone 8 Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • Drumroll please—it's chip time! Special thanks to the folks at TechInsights for helping scope out this silicon:

  • Apple 339S00434 A11 Bionic SoC layered over SK Hynix H9HKNNNBRMMUUR 2 GB LPDDR4x RAM

  • Qualcomm MDM9655 Snapdragon X16 LTE modem

  • Skyworks SkyOne SKY78140

  • Avago 8072JD130

  • P215 730N71T, likely an envelope tracking IC

  • Skyworks SKY77366-17 quad-band GSM power amplifier module

  • NXP Semiconductor 80V18 (PN80V) secure NFC module

掌声响起来！—现在是芯片的时间，感谢来自Techinsights的帮助，让我们来辨认这些芯片

苹果 （Apple）339S00434 A11仿生处理器，封装有海力士 H9HKNNNBRMMUUR 2GB LPDDR4x运存

高通（Qualcomm）骁龙 MDM9656 X16 LTE模组

思佳讯（Skyworks）SkyOne SKY78140

安华高科技（Avago）8072JD130

P215 730N71T，可能是追信IC模块

思佳讯（Skyworks）SKY77366-17 四波段GSM功率放大器

恩智浦半导体（NXP Semiconductor）80V18 (PN80V) NFC加密模块

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