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Smontaggio Huawei P9

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Huawei P9 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Huawei P9 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.

  • Here are the front-side chips:

  • HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix H9CKNNNDATMUQRN-UH LPDDR3 RAM

  • Samsung KLMBG2JENB-B041 32 GB eMMC NAND flash memory

  • Texas Instruments BQ25892 fast charging IC

  • HiSilicon Hi6402 audio codec

  • Maxim Integrated MAX98925 audio amplifier

  • Altek AL6610-72M1 AI camera processor (likely)

Chi ha lasciato qui la sua gomma da masticare? Alzando la scheda madre si scopre una quantità di pasta termica che da un po' di tempo non vedevamo in un telefono.

Ecco i chip sulla faccia anteriore:

Memoria RAM LPDDR3 da 24 Gb (3 GB) SKhynix H9CKNNNDATMU

Memoria flash eMMC da 32 GB Samsung KLMBG2JENB

Chip carica rapida Texas Instruments BQ25892

Codec audio HiSilicon Hi6402

[* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.
[* black] Here are the front-side chips:
- [* red] SKhynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMU|new_window=true] 24 Gb (3 GB) LPDDR3 RAM
- [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=true] 32 GB eMMC flash memory
+ [* red] HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] LPDDR3 RAM
+ [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB-B041|new_window=true] 32 GB eMMC NAND flash memory
[* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC
[* green] HiSilicon Hi6402 audio codec
+ [* light_blue] Maxim Integrated MAX98925 audio amplifier
+ [* blue] Altek AL6610-72M1 AI camera processor (likely)

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