crwdns2935425:06crwdne2935425:0
crwdns2931653:06crwdne2931653:0
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Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.
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Here are the front-side chips:
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HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix H9CKNNNDATMUQRN-UH LPDDR3 RAM
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Samsung KLMBG2JENB-B041 32 GB eMMC NAND flash memory
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Texas Instruments BQ25892 fast charging IC
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HiSilicon Hi6402 audio codec
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Maxim Integrated MAX98925 audio amplifier
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Altek AL6610-72M1 AI camera processor (likely)
| [* black] Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile. | |
| [* black] Here are the front-side chips: | |
| - | [* red] |
| - | [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB|new_window=true] 32 GB eMMC flash memory |
| + | [* red] HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix [https://www.skhynix.com/products.do?ct1=36&ct2=41&lang=eng|H9CKNNNDATMUQRN-UH|new_window=true] LPDDR3 RAM |
| + | [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/emmc/KLMBG2JENB-B041?ia=2324|KLMBG2JENB-B041|new_window=true] 32 GB eMMC NAND flash memory |
| [* yellow] Texas Instruments [http://www.ti.com/product/BQ25892|BQ25892|new_window=true] fast charging IC | |
| [* green] HiSilicon Hi6402 audio codec | |
| + | [* light_blue] Maxim Integrated MAX98925 audio amplifier |
| + | [* blue] Altek AL6610-72M1 AI camera processor (likely) |
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