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iPhone SE拆解

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iPhone SE Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone SE Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone SE Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0

  • We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory!

  • Apple A9 APL1022 SoC + SK Hynix 2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH

  • Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)

  • Qualcomm WTR1625L RF Transceiver (as seen in iPhone 6/6 Plus)

  • Qualcomm QFE1100 Envelope Tracking IC (as seen in 6s/6s Plus, and 6/6 Plus)

  • Skyworks SKY77611 Quad-band Power Amplifier Module

  • We'd like to extend a huge thanks to our friends at Chipworks for helping us ID all of these chips! Check out their rad teardown of the iPhone SE for even more silicon goodness.

我们把令人厌烦的后部接口从主板上去除，便可对壮观的硅基芯片领域一览无遗！

苹果 A9 系统芯片 APL1022 + SK 海力士 2 GB 内存 LPDDR4，标记为H9KNNNBTUMUMR - NLH

高通 MDM9625M LTE 调制解调器 （和 iPhone6/6 Plus 上的相同）

高通 WTR1625L RF 传送接收器（和 iPhone 6/6 Plus 上的相同）

高通 QFE1100 包络跟踪 IC （和 6s/6s Plus, 6/6 Plus 上的相同）

思佳讯 SKY77611 四频功率放大器模块

我们想对我们在 Chipworks 公司朋友表达由衷的谢意，感谢他们帮助我们辨认所有这些芯片！查看他们的拆解了解 iPhone SE 内部更多的芯片。

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