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iPhone 6拆解

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iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • Back side of the logic board:

  • SanDisk SDMFLBCB2 128 Gb (16 GB) NAND Flash

  • Murata 339S0228 Wi-Fi Module

  • Apple/Dialog 338S1251-AZ Power Management IC

  • Broadcom BCM5976 Touchscreen Controller

  • NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)

  • NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)

  • Qualcomm WTR1625L RF Transceiver

逻辑主板后面:

SanDisk SDMFLBCB2 128 Gb (16 GB) NAND闪存

村田339S0228 Wi-Fi 模块

苹果/对话框 338S1251-AZ电源管理IC

博通BCM5976触摸屏控制器

恩智浦LPC18B1UK ARM Cortex-M3的微控制器(也称M8运动协处理器)

恩智浦NFC 65V10模块+安全元件(内部可能包含恩智浦PN544 NFC控制器)

高通公司WTR1625L RF收发器

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