crwdns2933423:0crwdne2933423:0

iPhone 6 분해도

crwdns2936315:0crwdne2936315:0
crwdns2936325:0crwdne2936325:0
crwdns2931653:017crwdne2931653:0
iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:01crwdne2935265:0
  • Back side of the logic board:

  • SanDisk SDMFLBCB2 128 Gb (16 GB) NAND Flash

  • Murata 339S0228 Wi-Fi Module

  • Apple/Dialog 338S1251-AZ Power Management IC

  • Broadcom BCM5976 Touchscreen Controller

  • NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)

  • NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)

  • Qualcomm WTR1625L RF Transceiver

로직 보드의 후면:

SanDisk SDMFLBCB2 128 Gb (16 GB) NAND 플래시

Murata 339S0228 Wi-Fi 모듈

Apple/Dialog 338S1251-AZ 전원 관리 IC

Broadcom BCM5976 터치스크린 컨트롤러

NXP LPC18B1UK ARM Cortex-M3 Microcontroller (별칭 M8 모션코프로세서)

NXP 65V10 NFC 모듈 + Secure Element (아마도 NXP PN544 NFC 컨트롤러 내장)

Qualcomm WTR1625L RF 송수신기

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0