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iPhone 6拆解

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iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • The front side of the logic board:

  • Apple A8 APL1011 SoC + SK Hynix RAM as denoted by the markings H9CKNNN8KTMRWR-NTH (we presume it is 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus)

  • Qualcomm MDM9625M LTE Modem

  • Skyworks 77802-23 Low Band LTE PAD

  • Avago A8020 High Band PAD

  • Avago A8010 Ultra High Band PA + FBARs

  • Skyworks 77803-20 Mid Band LTE PAD

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo

这是主板前面

苹果A8晶片＋SK海力士闪存，上头标示代号为：H9CKNNN8KTMRWR-NTH (我们猜测，跟iPhone 6 Plus一样，这是个容量为1G的低电压快闪记忆体)

高通MDM9625M LTE 调制解调器

思佳讯 77802-23 LTE低频段功率信号放大器

安华科技 A8020 高频段功率信号放大器

安华科技 A801​​0 超高频段功率信号放大器 + 薄膜体声波谐振器

思佳讯77803-20 中频段LTE PAD

应美盛 MP67B 六轴陀螺仪与加速器

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