crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

iPhone 6 분해도

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crwdns2936315:0crwdne2936315:0
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iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • The front side of the logic board:

  • Apple A8 APL1011 SoC + SK Hynix RAM as denoted by the markings H9CKNNN8KTMRWR-NTH (we presume it is 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus)

  • Qualcomm MDM9625M LTE Modem

  • Skyworks 77802-23 Low Band LTE PAD

  • Avago A8020 High Band PAD

  • Avago A8010 Ultra High Band PA + FBARs

  • Skyworks 77803-20 Mid Band LTE PAD

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo

로직 보드 전면:

H9CKNNN8KTMRWR-NTH 표시 Apple A8 APL1011 SoC + SK Hynix RAM (iPhone 6 Plus와 동일한 1GB LPDDR3 RAM으로 가정)

Qualcomm MDM9625M LTE 모뎀

Skyworks 77802-23 Low Band LTE PAD

Avago A8020 High Band PAD

Avago A8010 Ultra High Band PA + FBARs

Skyworks 77803-20 Mid Band LTE PAD

InvenSense MP67B 6-축 자이로스코프와 가속도계 콤보

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