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iPhone 6 Plusの分解

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iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 6 Plus Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Let's identify some ICs on the front side of the logic board:

  • Apple A8 APL1011 SoC + Elpida 1 GB LPDDR3 RAM (as denoted by the markings EDF8164A3PM-GD-F)

  • Qualcomm MDM9625M LTE Modem

  • Skyworks 77802-23 Low Band LTE PAD

  • Avago ACPM-8020 High Band PAD

  • Avago ACPM-8010 Ultra High Band PA + FBARs

  • TriQuint TQF6410 3G EDGE Power Amplifier Module

  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo

基盤の表側にあるチップを確認してみましょう。

Apple A8 APL1011 SoC + Elpida 1 GB LPDDR3 RAM (EDF8164A3PM-GD-Fと表記されている)

Qualcomm MDM9625MLTE モデム

Skyworks 77802-23 Low Band LTE PAD

Avago ACPM-8020High Band PAD

Avago ACPM-8010Ultra High Band PA + FBARs

TriQuint TQF64103G EDGE パワーアンプモジュール

InvenSense MP67B6-axis ジャイロスコープと加速度メーターのコンボ

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