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2013年末Mac Pro 拆解

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Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Let's identify the ICs on the rear of the logic board:

  • LGA 2011 (Socket R) CPU socket

  • Microchip EMC1428 8-Channel Temperature Sensor Monitor

  • International Rectifier IR3575 Synchronous Buck Gate Driver with integrated MOSFET and Schottky diode

  • NXP PA9517A Level Translating I2C-Bus Repeater

  • Texas Instruments 58872D

  • The front side of the logic board:

  • Intersil ISL 6367 Hybrid Digital Dual PWM Controller

让我们来看一下主板上的其它IC：

LGA 2011 （R插槽）CPU插槽

微芯（Microchip）EMC1428 8通道温度传感监视芯片

国际整流器（International Rectifier）IR3575带有一体式MOSFET和肖特基二极管的同步降压门驱动器

恩智浦半导体（NXP） PCA9517A 电平转换I2C总线中继器

德州仪器 59972D

主板的正面有：

英特矽尔（Intersil）ISL 6367 混合数字双PWM控制器

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