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Mac Pro Late 2013 분해도

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Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Let's identify the ICs on the rear of the logic board:

  • LGA 2011 (Socket R) CPU socket

  • Microchip EMC1428 8-Channel Temperature Sensor Monitor

  • International Rectifier IR3575 Synchronous Buck Gate Driver with integrated MOSFET and Schottky diode

  • NXP PA9517A Level Translating I2C-Bus Repeater

  • Texas Instruments 58872D

  • The front side of the logic board:

  • Intersil ISL 6367 Hybrid Digital Dual PWM Controller

로직 보드 후면의 칩셋을 식별해봅시다:

LGA 2011 (Socket R) CPU 소켓

Microchip EMC1428 8-채널 온도 센서 모니터

통합 MOSFET과 Schottky 다이오드가 있는 International Rectifier IR3575 동기식 벅 게이트 드라이버

NXP PA9517A 레벨 번역 I2C-버스 리피터

Texas Instruments 58872D

로직 보드의 전면:

Intersil ISL 6367 하이브리드 디지털 듀얼 PWM 컨트롤러

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