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2013年末Mac Pro 拆解

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Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Mac Pro Late 2013 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • A view from above: The Mac Pro utilizes a giant triangular heat sink ("Thermal Core"), shared by the dual graphics cards and CPU.

  • Looks like the Mac Pro has taken some design pointers from the recent AirPort Extreme and Time Capsule bodies: a thin, vertical design with individual boards on separate sides.

  • We use our spudger to pry the graphics card data connectors from their sockets. This FCI Meg-Array connector is the same type used for the G4 & G5 PowerPC processor daughtercards, and looks to be a fully custom way of hooking up PCI-E, with many pins in a pressed-in connector.

俯视图:Mac Pro使用了一个巨大的三角形散热器(“ 热芯”),由双显卡和CPU共享。

看起来Mac Pro借鉴了最近的AirPort ExtremeTime Capsule 机身的一些设计要点:薄而垂直的设计,在单独的侧面上有独立的板。

我们使用撬棒从其插槽撬起图形卡数据连接器。 FCI Meg-Array连接器与G4和G5 PowerPC处理器子卡所使用的类型相同,并且看起来是一种完全定制的PCI-E的连接方式,其压入式连接器中有许多针脚。

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