crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

Xbox Series X/S 無線控制器搖桿更換

crwdns2935419:0crwdne2935419:0
crwdns2936315:0crwdne2936315:0
crwdns2936311:0crwdne2936311:0
crwdns2931653:06crwdne2931653:0

  • For full instructions on how to desolder through-hole solder joints, click here.

  • Set your soldering iron to 375 °C (707 °F) and press the tip against a joint to heat it.

  • Don't heat the joint longer than 15 seconds at a time, or you risk damaging the solder pad.

  • If you're having trouble melting the solder joint, apply some leaded solder onto your soldering iron tip and try again. The leaded solder helps with heat transfer while lowering the melting temperature of the existing lead-free solder joint.

  • Once the joint's molten, use a desoldering pump to suck away the solder.

  • Repeat the heating and sucking procedure a few times on the same joint to remove as much solder as possible.

  • Don't heat the joint continuously for longer than 15 seconds at a time to avoid damaging the pad.

如需获取如何拆除通孔焊点的完整说明，请点击此处。

将烙铁温度设定为375 ℃（707 °F），把烙铁头压在焊点上进行加热。

每次加热焊点的时间不要超过 15 秒，否则有损坏焊盘的风险。

如果你难以熔化焊点，可以在烙铁头上涂一些含铅焊锡，然后再试。含铅焊锡有助于传热，同时能降低现有的无铅焊点的熔化温度。

焊点熔化后，立刻使用吸锡泵吸掉焊锡。

在同一焊点上重复加热和抽吸几次，以尽可能多地去除焊锡。

每次持续加热焊点的时间不要超过 15 秒，以免损坏焊盘。

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0