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移除主板

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Logic Board Removal, Reassembly information: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 Logic Board Removal, Reassembly information: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 Logic Board Removal, Reassembly information: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
Reassembly information

  • During reassembly, perform the following to clean the thermal paste:

  • Use the flat end of a spudger to scrape off the thermal paste on the bottom of the logic board.

  • Clean any remaining thermal paste residue with isopropyl alcohol (>90%) and either a coffee filter or a lint-free cloth.

  • Repeat the cleaning process for the thermal paste on the frame.

  • During reassembly, follow this guide to reapply thermal paste to your device.

  • When applying new thermal paste, use the flat end of a spudger to spread it evenly across the logic board. Try to match the original spread.

重新组装的相关信息

在重新组装时，按照下列步骤清洁散热膏：

使用撬棒的扁平一端，刮掉残留在主板底部的散热膏。

使用无纺布或咖啡滤纸，结合90%浓度的异丙醇酒精，擦拭表面，移除所有残留的散热膏。

重复上述步骤，清洁边框上的散热膏。

在重新组装时，参照此指南重新涂抹散热膏。

在涂抹新的散热膏时，使用撬棒的扁平一端将散热膏均匀涂抹在主板表面。尽量达到与原装相近的覆盖面积。

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