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Rimozione scheda madre iPhone 13 Pro

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iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 13 Pro Motherboard Separation: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • Apply some Paste Flux to the bonding pads. Align the logic board with the signal board. Keep heating with the Heating Platform at 170 °C. Add heat around the motherboard with Hot Air Gun at 330 °C.

Applica del flussante sui cuscinetti di collegamento. Allinea la scheda logica con la scheda di segnale. Continua a riscaldare con la Piattaforma Riscaldante a 170°C. Aggiungi calore attorno alla scheda madre con la pistola ad aria calda a 330°C.

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