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Consejos para la separación y recombinación de placas de doble apilado del iPhone X-12

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iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • The logic board and middle layer are soldered with low-temperature solder paste. So the best temperature for the heating platform will be 155 °C-165 °C.

  • Push the logic board gently with tweezers when the temperature reaches 165 °C. If the logic board is loose, the tin has melted.

La placa lógica y la capa intermedia están soldadas con pasta de soldadura de baja temperatura. Entonces, la mejor temperatura para la plataforma de calentamiento será de 155 °C a 165 °C.

Empuja la placa lógica suavemente con pinzas cuando la temperatura alcance los 165 °C. Si la placa lógica está suelta, la resina se ha derretido.

[* black] The logic board and middle layer are soldered with low-temperature solder paste. So the best temperature for the heating platform will be 155 °C-165 °C.
-[* black] Push the logic board gently with tweezers when the temperature reaches 165 °C. If the logic board is loose, the tin has melted.
+[* black] Push the logic board gently with [product|IF145-020|tweezers] when the temperature reaches 165 °C. If the logic board is loose, the tin has melted.

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