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Consejos para la separación y recombinación de placas de doble apilado del iPhone X-12

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iPhone X-12 Double-stacked Board Separation & Recombination Tips, iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone X-12 Double-stacked Board Separation & Recombination Tips, iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone X-12 Double-stacked Board Separation & Recombination Tips, iPhone X-12 Double-stacked Board Separation & Recombination Tips: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
iPhone X-12 Double-stacked Board Separation & Recombination Tips
  • Peel off foam on the motherboard before heating.

  • Please be noted that we do not recommend beginners to heat the motherboard with a hot air gun. Because the motherboard may receive heat unevenly and deform. A professional motherboard heating platform is what we suggest.

  • To facilitate later removal of the logic board, drive a screw on the logic board.

  • Cut through the tape with a Sculpture Knife.

Retira la espuma de la placa base antes de calentar.

Ten en cuenta que no recomendamos que los principiantes calienten la placa base con una pistola de aire caliente. Porque la placa base puede recibir calor de manera desigual y deformarse. Una plataforma de calentamiento de placa base profesional es lo que sugerimos.

Para facilitar la extracción posterior de la placa lógica, coloca un tornillo en la placa lógica.

Corta la cinta con un cuchillo para esculpir.

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