crwdns2936637:0crwdne2936637:0 crwdns2853008:0crwdne2853008:0 crwdns2918746:0crwdne2918746:0

Smontaggio Xiaomi Mi 11

crwdns2935419:0crwdne2935419:0
crwdns2936315:0crwdne2936315:0
crwdns2936321:0crwdne2936321:0
crwdns2931653:06crwdne2931653:0
Xiaomi Mi 11 Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 Xiaomi Mi 11 Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0

  • And on the even darker rear side, a huge expanse of copper conceals these tiny bits of silicon:

  • Qualcomm SM8350 Snapdragon 888 (5 nm) with integrated X60 modem, layered underneath Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 3200MHz

  • SK Hynix HN8T05BZGK 128GB flash memory chip UFS 3.1

  • Wi-Fi/BT 5.2 WCN 6851 Wi-Fi 6 wireless combo SoC

  • Qualcomm SDR868-RF transceiver chip

  • Qualcomm SMB1396 fast charging chip

  • Nuvolta NU1619A wireless power receiving chip

  • Qorvo QM77033D front-end module

E sul lato ancora più oscuro posteriore, c'è un'enorme distesa di rame che nasconde questi piccoli pezzi di silicio:

Qualcomm SM8350 Snapdragon 888 (5 nm) con modem integrato X60, stratificato sotto la RAM Samsung K3LK7K70BM-BGCP 16 Gb LPDDR5 da 3200MHz

Chip con 128 GB di memoria flash UFS 3.1 SK Hynix HN8T05BZGK

SoC combinato Wi-Fi 6 WCN 6851 per Wi-Fi e BT 5.2

Chip ricetrasmettitore RF Qualcomm SDR868

Chip ricarica rapida Qualcomm SMB1396

Chip ricevitore alimentazione wireless Nuvolta NU1619A

Modulo front-end Qorvo QM77033D

crwdns2944171:0crwdnd2944171:0crwdnd2944171:0crwdnd2944171:0crwdne2944171:0