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iPhone 12 mini 拆解

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iPhone 12 mini Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:02crwdne2935265:0 iPhone 12 mini Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:02crwdne2935265:0
  • After learning the finer points of US vs. EU sandwicherie, let's tuck into the (mostly familiar) US silicon layers:

  • Apple APL1W01 A14 Bionic SoC with Micron MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM layered over it (same as the iPhone 12/12 Pro)

  • 1UED, most likely a U1 ultra-wideband chip similar to the USI chip in other iPhones

  • STMicroelectronics STWPA1-3033ABM wireless charging IC, possibly something similar to their STWBC-EP chip

  • KIC M224 BE0408 TWNA 12031, 64 GB of Kioxia NAND flash memory

  • Qualcomm SDR865 5G and LTE transceiver

  • Qualcomm SDX55M 5G modem-RF system and SMR526 intermediate frequency IC

  • Apple APL1094 power management IC

在了解了美版与欧版主板的差异之后,让我们开始介绍(最熟悉的)美国芯片:

苹果APL1W01 A14仿生SoC,附带Micron D9XMR 4 GB LPDDR4 SDRAM(与iPhone 12/12 Pro相同)

1UED,很可能是类似于其他iPhone中的USI芯片的U1超宽带芯片

STMicroelectronics STWPA1-3033ABM无线充电IC,可能与其STWBC-EP芯片相似

KIC M224 BE0408 TWNA 12031,64 GB的Kioxia NAND闪存

高通SDR865 5G和LTE收发器

高通SDX55M 5G调制解调器-RF系统和SMR526中频IC

苹果APL1094电源管理IC

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