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iPhone 12 mini 拆解

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iPhone 12 mini Teardown: crwdns2935265:00crwdnd2935265:01crwdnd2935265:03crwdne2935265:0 iPhone 12 mini Teardown: crwdns2935265:00crwdnd2935265:02crwdnd2935265:03crwdne2935265:0 iPhone 12 mini Teardown: crwdns2935265:00crwdnd2935265:03crwdnd2935265:03crwdne2935265:0
  • Let's check out these logic board sandwiches. For reference, the US version is on top in these images, EU below. (Don't read into it—that's just how the chips fell.)

  • First, the similarities—the US and EU upper sections are identical and have the same spread of chips on both sides.

  • The lower sections are a bit more interesting. (Note: SIM readers are the same, but we only desoldered it from the US version.) Here's where the US board starts accommodating all that mmWave tech:

  • An extra socket, which connects to the front mmWave antenna mentioned in the previous step

  • A Murata 1XR-482 mmWave front-end module

  • A Qualcomm SMR526 intermediate frequency IC, working in conjunction with Qualcomm's SDX55M 5G modem

  • One more mmWave antenna right on the board

  • A flex cable soldered to this patch, which connects to the side edge mmWave antenna

来看看这些三明治主板。作为参考,照片中最上面的是美版,下面是欧版。

首先,相似之处-美国和欧盟的上半部分是相同的,并且芯片的摆放区域是相同的。

下半部分就有点意思了。 (注意:SIM卡读卡器是相同的,但我们仅从美版上将其拆焊。)以下是美版iPhone容纳所有毫米波技术的地方:

一个额外的插座,可连接到上一步中提到的前端mmWave天线

Murata 1XR-482 mmWave前端模块

Qualcomm SMR526中频IC与Qualcomm的SDX55M 5G调制解调器配合使用

主板上还有一个毫米波天线

一条柔性电缆焊接到此贴片,并连接到侧边毫米波天线

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